Positioning: A flat upgraded version of the GTH series with a 40% height reduction, specially designed for scenarios with limited installation space.
Core Features:
One-piece steel structure with 30% improved rigidity and a running parallelism of ±0.02mm.
Lead configurations consistent with the GTH series: GTH4 (2/6/12mm), GTH5 (2/5/10/20mm).
Patented external lubrication design enables simultaneous maintenance of the ball screw and guide rail, reducing maintenance time by 50%.
Long-stroke M models: GLTH8M (ball screw drive) with a maximum stroke of 2.5m; GLTB8 (belt drive) with a maximum stroke of 4m.
Applications: Precision assembly fields such as electronic manufacturing, semiconductor equipment, and medical instruments.
Technological Breakthrough: Integrated design of the mover and slider, improving heat dissipation efficiency by 60%.
Performance Highlights:
Repeat positioning accuracy of ±1μm and running parallelism of 0.015mm/m.
Reduced slider height and vibration, with 40% faster response speed.
Standard external pull-type oil nozzle for convenient maintenance, extending service life by 30%.
Applications: Full semiconductor manufacturing processes, LCD/OLED panels, LED packaging, and pre-processes of lithium batteries.
Eight Major Upgrades:
Lightweight design with 25% weight reduction and 20% improved rigidity.
Accuracy enhanced to ±3~5μm, with a maximum horizontal load capacity of 400kg and vertical load capacity of 200kg.
Optional C5-class high-precision ball screws, increasing rotation speed by 50%.
Intelligent diagnosis system for real-time monitoring and early warning, reducing downtime risk by 40%.
Modular interface design, cutting installation time by 60%.
Applications: High-precision manufacturing fields including semiconductors, 3C electronics, and new energy equipment.
ETH2 Features: Dual linear guide rail design, with a maximum horizontal load capacity of 110kg and repeat positioning accuracy of ±0.005mm.
ECH2 Features:
Specialized for cleanrooms, achieving CLASS10 cleanliness through vacuum suction.
Customizable body colors and open-type specifications to meet diverse environmental requirements.
Applications: Semiconductor cleanrooms, medical equipment, and precision testing instruments.
Enhanced GCH Series: Equipped with an external negative pressure connector, which can be connected to a vacuum source to extract internal dust, improving cleanliness to CLASS1.
ECB22 Cleanroom Belt Module: Maximum stroke of 3500mm, load capacity of 85kg, and CLASS10 cleanliness, making it the preferred choice for the semiconductor industry.
Built-in Sensor System: Real-time monitoring of temperature, vibration, and load, with data uploadable to the industrial cloud via the TC100 controller.
AI Algorithm Optimization: Automatically adjusts parameters, reducing energy consumption by 20% and improving operational efficiency by 15%.
Communication Upgrade: Supports multiple protocols (pulse, LS, 485, IO, EZK bus) for more convenient system integration.
Wafer Handling: GCH series modules combined with vacuum adsorption enable precision operations in CLASS1 environments, reducing wafer breakage rate by 50%.
Testing Equipment: LGCW modules applied in AOI testing achieve an accuracy of ±1μm, increasing testing efficiency by 30%.
Advanced Packaging: Second-generation ETH2 modules realize a positioning accuracy of ±0.005mm in Fan-out packaging, improving yield by 25%.
Lithium Battery Equipment: GLTH series modules used in pole piece cutting and winding processes achieve a positioning accuracy of ±0.005mm, boosting production efficiency by 20%.
Photovoltaic Manufacturing: LGCW modules applied in silicon wafer sorting equipment reach a speed of 1.5m/s, increasing production capacity by 40%.
Mobile Phone Assembly: GTH series modules used for camera module installation and screen lamination achieve an accuracy of ±0.02mm, raising production capacity by 25%.
PCBA Testing: ETH series modules paired with probe stations realize high-speed multi-station switching, improving testing efficiency by 50%.
Suzhou Factory Expansion: Completed in September 2025, increasing production capacity by 50%, with a focus on manufacturing GLTH and LGCW series.
Dongguan New Production Line: Put into operation in November 2025, specializing in cleanroom series (ECH/GCH) and linear motor modules.
Sales Channel Adjustment: Shifted from regional general agency system to a dual-track model of "regional distribution + industry verticalization", improving response speed by 70%.
Increased R&D Investment: Annual R&D expenditure increased by 30%, focusing on the development of AI intelligent modules and lightweight high-rigidity materials.
Standardization Strategy: Transformed from customized production to standardized module development, reducing costs by 40% and shortening delivery cycles by 50%.
Won two awards in 2025: "Customer Trusted Brand" and "Innovative Product".
GCH/ECH series obtained SGS certification, confirming their suitability for CLASS10 environments.
LGCW modules received CE and UL certifications, enabling global sales.
TOYO's 2025 new product portfolio focuses on the four core pillars of high precision, high rigidity, low energy consumption, and intelligence. In particular, the launch of the GLTH flat series and LGCW linear motor modules marks the company's technological leadership in the field of compact automation.
Selection Recommendations:
Scenarios with limited space → GLTH Series
High-precision cleanroom environments → ECH2/GCH Series
High-speed and light-load applications → LGCW Linear Motor Series
Heavy-load and high-precision applications → Second-Generation ETH2 Series
